Do you want to desolder electronic components from your assembly and solder on new components where necessary? We offer you a professional repair service for this. With state-of-the-art equipment, fine-pitch components (BGA, QFP, QFN, etc.) or complex SMD connectors (e.g. ERNI MicroSpeed) are reworked without the use of extreme temperatures. If necessary, we analyze the solder joints with an X-ray machine.

Our know-how

• Desoldering complex components such as BGA, QFP, QFN, ERNI MicroSpeed
• Non-contact residual solder extraction
• High precision automated dispensing of solder paste
• Positioning and soldering of complex components
• Automatic process control and process documentation

Equipment

• Rework station Zevac Onyx29