We assemble your PCBs with electronic components in SMT (surface mount technology), in the conventional THT wave soldering process (through hole technology), in a combination of both processes, the new THR process (through hole reflow). All soldering processes can be performed with both lead-free solders and solders containing lead. We would be happy to take care of the complete material procurement for you.

Our know-how

• 24-hour assembly service
• Parts list preparation and documentation service
• Cost-effective material procurement by means of purchasing synergies in the ERNI company group
• SMD assembly of fine-pitch components (e.g. BGA, QFN, QFP, ERNI MicroSpeed connector)
• Handling components susceptible to moisture (moisture sensitive level ≥ 3)
• Automated optical inspection (AOI) of SMD assemblies
• THT assembly (wave soldering)
• Soldering processes free of or containing lead
• Production and check of the assemblies as per IPC-A610 class 2
• Prototypes, small and medium series up to about 1,000 assemblies per batch

SMD assembly equipment

• 2 SMD assembly lines
• Stencil printing with integrated automated soldering paste inspection
• Pick-&-place machines with an assembly capacity of up to 30,000 components/hour
• Convection soldering systems with nitrogen atmosphere
• Automated optical inspection device (AOI)
• Maximum PCB size: 510 x 460 mm
• Maximum component height: 25 mm

THT assembly equipment

• Prototype production
• 2 THT assembly lines
• Lead-free wave soldering system with nitrogen atmosphere
• Wave soldering system containing lead with nitrogen atmosphere
• Automated assembly tables
• Maximum PCB size: 480 x 280 mm
• Maximum component height: 95 mm